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BOGA TÉCNICA will attend HISPACK 2018


Boga Técnicais pleased to announce that it will attend the HISPACK 2018 fair as an exhibitor.

At HISPACK 2018, Bogatécnica will be in Hall 3, Level 0, Stand A185.

HISPACK will be held in Barcelona from May 8 to 11.

HISPACK is an international meeting of packaging professionals, we can account for the latest developments in the sector.

If you wish, you can request your invitation at or by calling +34 943 667 607.

Member of


Polígono Soroxarta Burniola 1,
Edificio circular 1ª
20301 Irún (Spain)
+34 943 66 76 07