BOGA TÉCNICA will attend HISPACK 2018

Boga Técnicais pleased to announce that it will attend the HISPACK 2018 fair as an exhibitor.

At HISPACK 2018, Bogatécnica will be in Hall 3, Level 0, Stand A185.

HISPACK will be held in Barcelona from May 8 to 11.

HISPACK is an international meeting of packaging professionals, we can account for the latest developments in the sector.

If you wish, you can request your invitation at info@bogatecnica.com or by calling +34 943 667 607.